Sunday, September 6, 2009

One Stop Solution for LED Manufacturing



Only one company in the World can provide us one stop solution for LED manufacturing equipment.

As they supply bare die sorting machine, Die bonder of various process types such as Epoxy, Direct Eutectic, Flip Chip TS process for various LED chip attach,
Gold ball wire bonder for horizontal and vertical LED devices.

The latest iHawkxtreme is of the fastest wire bonder for LED. It was well recognized as the standard wire bonder for high throughput LED manufacturing environment.

Down the process they have solution on phosphor jetting, Testing and sorting solution for LED of different package TopLED, SideView, Ceramic base HBLED, with various process requirement of say Bowl feeder input, LED on wafer form, output with Tape and Reel or to be sorted on Mylar on film frame for sake of traceability required by Automobile and General illumination industry.

There is certain advance if we use one stop solution. There is minimum tools investment as all equipment can utilize the same tooling such as magazines and carrier. Minimum, investment for spare part as all machines are using the similar modules of control and Motion drivers!

An unique operational pattern as the machine are using same human interface for operation.

Simplify is the key for a streamed line process of Today Hi volume LED manufacturing by going through one supplier, consideration on administration, Single supplier training programme, spare part management, process uniqueness, On line Production System management.

This Company was found in 1975. It is ASM!

Saturday, September 5, 2009

China International Optoelectronic Exposition

iHawk V ASM Gold Ball Wire bonder for Vertical LED Lamps


ShenZhen Convention and exhibition centre

The China International Optoelectronic Exposition (CIOE) is a worldwide renowned exhibition, which presents the most advanced optoelectronic technologies and innovations.


The CIOE 2009 expects around 2,100 exhibitors to showcase products on 70,000 sqm from September 6-9. During the four days, more than 85,000 professional visitors will attend the exhibition.


It is supported by all relevant Chinese government bodies, scientific academies, trade associations, and by domestic as well as international key players of the industry.

Key LED Exhibitors:
OSRAM, DOMINANT, OASIS, COTCO, LUXPIA, MOKSAN, EDISON, BRIGHTEK, HP LIGHTING, WAITRONY, ELS, CT TECH, SHIN-ETSU, DENKI KAGAKU, ASM, NIHON GARTER, LUMITECH, CHANG-YU, WECON, LIANCHUANJIANHE, LAMP, HUAHAI etc.

ASM, world No. 1 Semiconductor equipment manufacturer makes her debut of the following equipment.

AD860
New Die bonder that can hanle 8” dia substrate as on the Work holder, good for PCB, Ceramic Panel or Si Type Substrate for LED bonding.

iHawk Xtreme is ASM's latest Gold ball Wire bonder which has a higher UPH that can outperform the strongest rivals in the Market by min. 15% for LED application.


Hawk-V- Gold bal wire bonder for Vertical LED lamps , 60 ms wire bonding speed, 10% smaller footprint, 0 down time due to magazine changes.

PhononDS520 – A Jetting phosphor application dispensing Machine, 50K UPH on vertical LED phosphor coating application.



SLS230T- test and sort machine for Top LED device with bowl feeder input, UPH is typically 18K for 3014, 3020, 3528 Device.


SLT400 – A high speed taping machine with Bowl feeder input , UPH 40K for 5252 Top LED device.


The Shenzhen Convention & Exhibition Center was designed by the German architects GMP with the lastest exhibition facilities. It is located in the downtown area of Shenzhen. It is connected to all major transportation systems and throw stone distance away from all parts of the city. Many four- and four-star-hotels and top restaurants are situated within walking distance.


Map Sorting of Package LEDs onto frames






ASM MS899DLA is a high speed map sorter machine especially designed for handling ceramic based LED with dome lens. Input is a cassette of film frame carrying the package LED on the film frame.
The reason is that the LED has to have tracebility up to die level, if that is not placed on mylar in a mapped format, there is no way to trace the LED to the die batch form the Wafer.

The up stream process is either a Panel tester using Integration sphere or a Package LED tester AS899 (ASM’s).

MS899DLA is a fully automatic map sorter machine with Auto cassette handler and max.
120 Bin grade of film frame each represent one specified Bin grade of binned LEDs.

There is a wafer bar code reader to read the lot bar codes or using 2D matrix code camera to read, identify and pull pout the right wafer map from the network for the film frame in process.
The UPH is typically 4,200 for 3mm x3 mm package LED with dome lens.

The Collet is designed not to have any contact on the surface of the dome to minimize scratches.
Typical Cycle time is 430ms for 3 mm x 3mm x 1.6 mm LEDs.

This machine is commonly used for many LED Big players for sorting out their package LED onto 100 bin grades.

Downwards process is to pass the binned wafer on Taping machine LPT08 for putting the package LED onto tape and reel.

The Globe, A Tatoo, The Youniverse, and A Dare

Not too long ago, Globe Tatoo is equivalent to Globe Broadband branded as 'hip.' Now, Globe Telecoms rebranded it to cover a myriad of services central to the new Globe Tattoo sim.In a recent bloggers' launch at M Cafe and Handle Bar in Makati, Globe introduced the Globe Tattoo Sims, Youniverse, ImmortalTXT, and Surf All Day services.Globe Tattoo SimsIt brought the modern, hip, and rebellious

Yike Bike


The Yike Bike has today been wooing Europeans on German streets as its developers try to sell their new mini-farthing cycle to the European market.


Inventor Grant Ryan said he hoped its European debut would spark interest ahead of a major trade fair later this week.


The New Zealand carbon fibre Yike Bike can run for 10km after a 30 minute charge, 10Kg in weight , install in 15 Sec, easy to control, LED lighting design. A green toy for us? We have to reserve for one. Price? May be in the range of USD$5,000.
My Friend Leo is the No. 1 HK people on the order reserve List.

I am sure that there will be newer design from China selling at about USD$900 in April 2010.

Let’s see

Small and Big Chip Design and efficacy

Blue represents the optical power and Purple indicates the Electrical power



LED efficacy is 25%, 75% of the electrical energy will be converted to heat energy, however when the smaller LED is having smaller power with say 20mA of current passing through, they efficacy could be as higher 55%.



There will be 55% of optical power Lumens output and 45% of energy will be dissipated as heat energy. however when the current increased say to 350mA, the efficacy can be about 25%. 75% of the electrical energy will be dissipated as heat energy which is a waste!

So we can see that there is a big different in LED design on the East and the West.
As most of the LED in Japanese Maker are using comparative small chip 0.2mm x 0.2 mm to 0.29mm X 0.29mm current such as 20-50mA range by using a number of small Chip to create more optical Lumens. Such design in fact as much a higher energy conversion than driving the LED at much a high current say 350mA or more, as when chip is bigger current .


But most of the US and or European design will be using 350mA as standard current reference for driving their LED. Such as K2, Rebel, XRE, XP, Oslon...

As for Japanese design such as Citizen, Sharp, we can see that they ar using a lot of LED from 10-20 pcs each of them are driving at smaller current, there will be a lot of manufacturing process as there will be multiple bonding on Die bonding and Multiple wires.


But the advantage is better energy saving, an some of them are connected in parallel, if there is one strand of LED chain is failure, there are still having some of the LED strands continue to light up. So as a reliability sense that is better. Whereas the other European Design will be black out of the LED is failed! So there thermal management of the current UHBLED will be an important engineering challenge for most of the LED players using big chip say 1mm x 1mm or bigger.

As we know if we have the best chip on hand, the final product reliability will be much depending on how low we can maintain the Junction Temperature. In any case we should design such a way to have a lowest Junction temperature of the Chip. Say if you can have a room temperature junction temperature, that is a dream case. And if you can maintain the Junction temperature at 85% m that is very good already, in worse case the junction temperature such not be higher than 125 Deg C.

As what highlight before if the temperature of the Chip is lower the life tine of the LED will be increased. Say form Rebel specification sheet if we can reduce 5 degrees from Junction temperate of 135 Degree C to 130 Degrees C, the life time of the Reel will be increased by 18,000 hours!!

If one day we can have a say Copper bas material and a very good of bonding connection material such as Solder (lead free is preferred) the Bond Line thickness is properly optimized for best CTE between the chip say EZ1000 and the Copper material. I think that is a very good design for low Junction temperature, as Copper is very good at heat energy conduction, and it is of low cost as comparing with AIN or Al2O3 ceramic substrates.



That can be a powerful LED… and if we can have very high efficacy Phosphor material and a good design of Lens, we may be able to create s very efficient LED with High Efficacy, good thermal conductivity, low cost as Solder is cheaper than Epoxy, or gold tin Eutectic process. However, the only concern is how good that it could sustain the reflow temperature say 260 deg C for two times. Will the Solder cause any delamination of the LED and the Substrates?

Philippine Fashion Week Spring / Summer 2010 Registration for Yako Reyes Show

Once again, similar to the Philippine Fashion Week Fall / Winter / Holiday 2009 guestlist for Yako Reyes early this year, the Philippine Fashion Week Spring / Summer 2010 registration for Yako Reyes show is already up.Register for the upcoming Philippine Fashion Week Spring / Summer 2010 for Yako Reyes HERE.IT would most probably be shown again at SMX beside SM Mall of Asia. Sign up now if you