Hong Kong International Lighting Fair 2010

The lights will be shining brightly at the HKTDC Hong Kong International Lighting Fair (Autumn Edition). As the largest event of its kind in Asia, and the second biggest in the world, it provides all the right connections to grow your business. There is a Seminar which representatives:

Dr Sun Tam, Director of Research & Development, Optiled Lighting International Ltd.
Mr Lawton Lee, Regional Sales & Marketing Director, Beghelli Asia Pacific, and
Mr Alvin Tse, Vice President, Philips Lumileds Lighting Company (Asia Pacific) have shared with us their idea on why we would have to go LED and Coming General Lighting of LED trend.

Feverip

The World Largest LED Show, The 12th China International Optoelectronics Expo, ShenZhen

The 12th China International Optoelectronic Expo in Shenzhen was held in the Fu Tian Exhibition hall this week. The LED Opto Product exhibition is in Hall 2 this year.
There are a lot of application on wall display, Huge TV using LED, though we can see a lot of different grade for display quality, we could foresee that the market is booming in this segment.

Most of the LED supplier, LED packager are coming form China, hardly can see anything from the top ten LED markers… Nichia, Cree, Osram, Seoul Semi, Philips Lumileds, Everlight and Liteon. Probably the customer are almost coming from China. There are a lot of Equipment Suppliers. Well, to be honest… I could say this is the largest Equipment show ever seen for LED product before… This Big names are here today, ASM, Kaijo, K & S, Musashi, NEC, MPI, Tripod, Plus a lot of smaller China LED equipment makers.

The product ranges from LED prober, Map Sorter, Die Bonder, Gold ball Bonder, Dispensing Machine, tester, sorter, Taping Machine…

Technology is still those renowned Leading suppliers like ASM who used extensively linear motors on their products, fiber communication system which matches with the speed of the CPU ensuring data is running supper fast at noise free environment.
The Harrier-Extreme is a Dual Head Gold Ball bonder which is being extensively used in IC assembly houses. Now it may one of the good tools for LED application say one head for 25 microns Gold wire on zener and the other for thicker wire say 30 microns for the HB LED chip!
Feverip

Coming LED show

LDI 2009
November 19-22, 2009
Orlando, Florida, United States
Lighting and sound show for the entertainment industry.

White LEDs 2009
December 01-05, 2009
Taipei, Taiwan
The Second International Conference on White LEDs and Solid State Lighting (ICWLEDSSL 2009)

Strategies in Light 2010
February 10-12, 2010
Santa Clara Convention Center, California, United States
The leading conference and exhibition for the LED and Solid-State Lighting global community.

LED China 2010
March 02-05, 2010
China Import and Export Fair Pazhou Complex, Area B, Guangzhou, China
With an overwhelming success of the last edition, LED CHINA 2010 will take place at Pazhou Complex, Guangzhou, again from March 2nd to March 5th, 2010. It is estimated that LED CHINA 2010 will gather about 350 exhibitors taking 25,000 sq. m. exhibition space. LED CHINA is a leading global event for LED application.

Light+Building 2010
April 11-16, 2010
Frankfurt am Main, Germany

Lightfair 2010
May 12-14, 2009
Las Vegas Convention Center, United States

electronica 2010
November 09-12, 2010
Munich, Germany
The world's leading trade fair for components, systems and applications. Meet decision-makers, developers and buyers.

LED Japan Conference & Expo/Strategies in Light

LED Japan Conference & Expo/Strategies in Light, is 2nd annual business conference and exhibition on high-brightness LEDs, held September 16-17, 2009 at Yokohama.

This year’s event nearly DOUBLED the previous attendance total of 2,710 set in 2008. In addition, the conference was supported by more than 60 sponsors and exhibitors, ranging from equipment and materials suppliers to LED and lighting fixture manufacturers to trade publications and industry associations.

This Event provided insight into the rapidly developing markets for LED lighting, backlights for LCD displays, and automotive headlamps, as well as other major trends in applications, industry structure, government policies, markets, products, and technologies that will affect the industry’s future.

The insight of LED Show and conference’s participant shows that there are more people is working on the LED industry and more resources and companies are being mobilized for going into LED market as solution providers.

China International Optoelectronic Exposition

iHawk V ASM Gold Ball Wire bonder for Vertical LED Lamps

ShenZhen Convention and exhibition centre

The China International Optoelectronic Exposition (CIOE) is a worldwide renowned exhibition, which presents the most advanced optoelectronic technologies and innovations.

The CIOE 2009 expects around 2,100 exhibitors to showcase products on 70,000 sqm from September 6-9. During the four days, more than 85,000 professional visitors will attend the exhibition.


It is supported by all relevant Chinese government bodies, scientific academies, trade associations, and by domestic as well as international key players of the industry.

Key LED Exhibitors:
OSRAM, DOMINANT, OASIS, COTCO, LUXPIA, MOKSAN, EDISON, BRIGHTEK, HP LIGHTING, WAITRONY, ELS, CT TECH, SHIN-ETSU, DENKI KAGAKU, ASM, NIHON GARTER, LUMITECH, CHANG-YU, WECON, LIANCHUANJIANHE, LAMP, HUAHAI etc.

ASM, world No. 1 Semiconductor equipment manufacturer makes her debut of the following equipment.

AD860
New Die bonder that can hanle 8” dia substrate as on the Work holder, good for PCB, Ceramic Panel or Si Type Substrate for LED bonding.

iHawk Xtreme is ASM's latest Gold ball Wire bonder which has a higher UPH that can outperform the strongest rivals in the Market by min. 15% for LED application.


Hawk-V- Gold bal wire bonder for Vertical LED lamps , 60 ms wire bonding speed, 10% smaller footprint, 0 down time due to magazine changes.

PhononDS520 – A Jetting phosphor application dispensing Machine, 50K UPH on vertical LED phosphor coating application.



SLS230T- test and sort machine for Top LED device with bowl feeder input, UPH is typically 18K for 3014, 3020, 3528 Device.


SLT400 – A high speed taping machine with Bowl feeder input , UPH 40K for 5252 Top LED device.


The Shenzhen Convention & Exhibition Center was designed by the German architects GMP with the lastest exhibition facilities. It is located in the downtown area of Shenzhen. It is connected to all major transportation systems and throw stone distance away from all parts of the city. Many four- and four-star-hotels and top restaurants are situated within walking distance.

HP LED Japan Strategies in Light Event 16-17 Sept.

LED Japan/Strategies in Light event being held September 16-17, 2009 in Yokohama, Japan.
Event Guide AD Reservation Deadline is July 30.

If you are a company that is a:
· LED manufacturer
· Supplier and distributor of equipment and materials to the LED industry
· LED system manufacturer
· Manufacturer of test & measurement equipment
· Manufacturer of design and production tools for LEDs
· Lighting product manufacturer

The Show will be Involving APPLICATIONS which include:
· General lighting
· Illumination
· Mobile applications
· Signs and signals
· Displays
· Automotive lighting

You should not miss the registration with dead line 30 July 2009!