Showing posts with label LED manufacturing Equipment. Show all posts
Showing posts with label LED manufacturing Equipment. Show all posts

Saturday, October 2, 2010

ASM MS100, the Fastest LED Map Sorter in the World

AS we know the LED market is hot and there seem had a slight slow down since End August and I believe this is some kind of Production and Product Adjustment as some excessive stock has been made.

We can see that there are more than 250 MOCVDs to be installed in China in the coming 9 months. So as a consequent, there is a need for a super High speed Map sorter to support this up stream LED sorting market.

The Clean room is going to be more expensive with land space is limited for expansion for some LED manufacturer.
Hence, A Compact, Hi Speed LED Map Sorter is needed…

MS100 is a high speed map sorter with Cycle time of 120ms (net UPH of 30K) that could beat the fastest Map sorter in the market. Currently the fastest Cycle time for map sorting a LED is approx. 175ms. That is what ASM MS899LDA and MS819DLA can achieve. MS100 is new generation map sorter machine  with a Cycle time of 125 ms... That is another 30% gain in Speed and UPH (Unit Per hour).
This Map sorter is using the latest Motion technology which delivers a direct couple Bond head with dual Arm pick and place process. That is to say whilst the Bond head is picking a die from the wafer, the bond arm is placing a die previously been picked up on the binning Mylar. Thus to ensure that the speed is 2 times faster than the previous in theory. But practically there is a lot f processes can not be elimintaed, so the Cycle Time would be 125 ms only. Some smart software has been embedded to ensure the right accurate search for Reference dies and good placement accuracy.
The average placement accuracy is about +/-1 mil and die rotation is within 1 degree range…

Another advantage is that the Vespal Hi Temp collet will enjoy a very long life time… That is a 2 times longer than all the market players. Don't forget that each time you change the collet, the machine has to be idle and 5 minute collet changing time that actually took away your 2,500 dies output. As an average the collet life can have 600K times. This is because the bond head impact force is low, and the Bond head design has been optimized with such a good low impact force on the collet, and on the die surface, thus the die is being protected from the “Micro Crack” problem which is the headache for down stream quality issues. That can not only kill the yield, and also the order as no Automaker would accept this kind of quality defects.
 In short, this MS100 LED Map Sorter is fast at 125ms Cycle time for 10mmx10mil LED chips, compact. That saves your clean room cost. Fully automatic with wafer Cassette input and output, 100 bin graded available... Hi MTBA for more than 2 hours.
Ultra Low TCO (total Cost of ownership) as there is no troublesome ball screws which is prone to contaminate your expensive blue chip when their lubrication grease will be evaporated into your clean room and your chip at the end of the days!

High Collet life time which save money for you Every Day and Every Shifts.

 
Make a Wise choice when you are going to consider the Map sorter Purchase.

 
Feverip

Sunday, June 13, 2010

How to capture this business opportunity of LED Market 2009-2012?

1995-2005
Since 1995 the LED market has been demonstrating amazing double digital annual growth rates through the year 2004. The worldwide market totals over 5.8 billion US$ in 2005, in which the high-brightness HB LEDs take more than 15% of market share. The increase by now has been largely driven by the wide utilization of mobile devices such as mobile phones and smart phone during the last few years. The main applications included keypad and display backlighting for these devices. Due to the disruptive technology has been using in the past three years with smaller chip with higher Lumens per watt, we did not see much growth in the equipment demand on Side view LED. The Korean, Japanese and Taiwanese LED maker has almost zero demand on bonding equipment. That was partly due Mobile phone is not growing much at all, and at the same time the capacity for side view comes to a saturated state. They just do not need extra back end Bonding Equipment.
Although the growth of the mobile phone market has shown signs of deceleration. Other new applications of LEDs will provide new highlights for the market expansion in the next 5-10 years. The major foci of the industry will be the utilization of LEDs in the Back light for LCD TV, monitor, Note Book and net book, general illumination and the automotive lighting.


HP LED Market
The breakthrough in white LED products and Ultra high brightness (UHB) LEDs, which produces more than 20 lumen per watt (the light output of normal 100-watt incandescent lamps), make the utilization of LEDs in the general lighting and automotive lighting visible. As the UHB LEDs are approaching to the output level of 80 lumen per watt, which is the output of standard fluorescent lights, they will by and by replace the fluorescent bulbs in households, offices and other places around the world in the future, because they are energy saving, less pollution, have better light quality and have a 2.5X lifetime than fluorescents. Up to 2015, the market segment of general illumination is expected to reach US$ 5.5 billion worldwide.


Back Light Unit demand
From my estimation that from the small bass number of 3% of LCD TV Back light market, there will be about 30% market for LCD TV using Back light unit in 2010 and there will be likely 60% of LVCDTV using LED Back light in 2011. That is a huge growth for the LED demand in this hot market. The HB LEDs are currently a $5 billion niche market comparison to $250 Million Semiconductors we used to say “IC” market. The backlight unit sectors will exhibit the fastest growth in the HB LED market with an overall compound annual growth rate (CAGR) of ,more than 40%, led by the LCD TV Sector exhibiting a CAGR of 280% between 2008-2012.


Packaged LED cost Breakdown
The Diagram show the Cost Structure of the LED manufacturing, they consists of backend process like Laser Substrate removal, Chip separation, Chip Sorting through wafer mapping, Die bonding, Curing, Wire bonding, Phosphor application, curing, Lens Moulding by Compression Mould. Singualtion, Testing, binning and taping. Laser marking. This will take up 60% of the Total cost of the package LED.As far as MOCVD, front End such as die probing, sawing, film mounting, Substrate of the LED, MOCVD takes up about 8 percents of a packaged LED. With such fast growing LED market demand, MOCVD equipment like Veeco Instruments would have to produce 208 tools in 2009 up to 420 tools in 2011. This consensus forecast of 420 Tools represents a market of over $1 billion base on an ASP of $2.5 Million for one MOCVD.




Price, Lumens and Output
For a higher adoption of LED in various application, the key factor if price. So if one can product a low cost and yet powerful LED, he will win the maker.What a good question is who can have the major control of the Back end Process which is contributing 60% of the Cost of the LED… beside he could get a constant good supply of LED say from Nichia, Epistar or Cree…


Position your LED market
That is a important question to someone who runs the LED, to make a standard LED package as others people are doing? To start an unique process!? Or to follow the Big Player utilizing the low cost structure of your factory to squeeze a dime more out of the LED!?


Equipment Delivery
I think 95% of the package in China are alike, and they way of manufacturing are more or less the same only bigger company has a better equipment price and delivery negotiation with the major equipment suppliers. There is a seen trend s that the large corporation will be using his power to issue a letter of intent or a Blanket order for a few hundred machines to be delivered over the months of 2011.


The Smaller companies may have less room for them to get a better price, delivery will be poor too. I the past year equipment delivery varies in the range of 8-12 weeks, now we can get a delivery quote of 20-24 weeks of courser all depend on how good your relationship with the supplier and how strong your buying power is!?


Equipment Suppliers
In the past there is no on keep an eye on the LED business as they were used to be smaller than the “IC” business. Now as you can see LED is more 20X larger than the ICs’ so there is a lot of equipment supplier going into this market, people start to spin off from one big company for set-up his company to get the order. Naturally this is a technology world a bigger firm definitely has a better technology than those smaller company. However, the truth is copy cats in China it is as much as the Copy rats… that just do not care how the support and reliability is. So long there is similar performance of output accuracy; they will just lower down the price say less 30% to get the order. Since copy is almost free in design… their R & D cost is almost Zero. But the poor customers will not be too stupid now to buy after a while the reliability of their equipment, or even the LED it built would have a big issue. Gold is Gold…. The trend is that those big companies will buy from the world renown equipment supplier for their Equipment and the smaller one who refer to the big one to follow… as once they know their :LED products would prone to be rejected by their end customer . They will just kill themselves by the poor LED Quality.


Critical Process
A few years back, a 15 years IC wire bonder engineers told me that there is no high technology at all to make a straight up neck lopping wire on a VLED (Vertical LED) lamp at all. All kind of bonding equipment would more or less do the same job well! Later when he got his hands on the Machine in or to optimize a proper looping height of 25 mil high with wire sway allowable of +/-1 mil. He finally gave up and told me that was even harder to perform an IC bonding with more than 1,000 wires per chip. I use wire bonding stage as to tell that bonding equipment can product better LED.


Packaging of a LED
There are numerous ways to package a LED, no matter what power level.
PLCC base, Ceramic base, MCPCB etc, LED like 1mmx1mm or small down to 6 mil x 6 mil, going for Silver Epoxy as the traditional way, or Flux Eutectic, Flip Chip or the latest way to package using Direct Eutectic for UHB LED application. The cost structure of the LED should well be understood for your packaging. If that is a general back light application, There is no need to go for Eutectic, High density matrix type of PLCC would be best for the machine utilization.


In case you go for K2 type of HB LED manufacturing, traditional type of K2 Leadframe has only 20 units on a strip is not good enough as it would seriously jardpodize the Throughput at all processes. Some of the latest leadframe design has 140 units, that would improve the throughput of the UPH at least 2X at die bonding, and silicone lens moulding stage.



LED cost breakdown
This is a typical cost breakdown of a 1 watt LED with 1mm x1mm LED chip on ceramic Substrate with Dome lens on top of it.
The chip itself accounts for almost 80% of the total material cost of the whole LEDs. So if you package in such a way the chip yield could be 1% higher, than you can easily save up to $50,000.00 for a monthly output of 100 millions package LED with an assumption of $0.50 for each of the chip. So if you can package it in such a way with Higher output at various stage, the yield loss could be say 1% lower or Testing cost 10% lower by using a more cost effective testing equipment than your competitors,. There are a lot of process points that you can work on, when you calculate the overall saving per month, that can be millions of dollars. 


Equipment Selection
The trick is there are too many factors such as material variation and bonder parameters set-up plus the Software capability of the Bonder, all these will contribute on how good the Looping looks likes… Well to a jelly bean LED marker, there might not be having much difference. But of your final product will be ultimately be use insider An Audi, Toyota, Panasonic or Samsung LCD TV. That will be a different story.
Questions will be asked… hey what is the best back End equipment to be considered for me. I think you can verify the statement: “No.1 is the best?”… If that is a true statement, that you should consider follow top major players; Nichia, Osram, Cree, Lumileds, Avago, Everlight, Liteon for their equipment selection.


Technology takes it all
The U.S. DOE’s Solid Stats Lighting Manufacturing Roadmap Targets a factor of Two improvement in Cost-of-Ownership for Manufacturing equipment every five Years. From this basic rules apply, who can fall into this category with their major company who can meet this COO Road Map? That will be your designated list of major suppliers for your LED manufacturing.
Feverip

Monday, April 5, 2010

How a LED Chip is Made!?

There is a very easy reading essay in Shuji Nakamura's Book "Brilliant"  teaches us how to make a LED.

"
The conventional method of making LEDs, liquid phase epitaxial could not grow films for high enough quality and sufficient thinness..

There are two more modern alternatives. Both were capable of growing films of material just a few atoms thick. One molecular beam epitaxial works via vacuum evaporation. MBE is especially popular with academic scientist. It can product small quantities of material, enough for researchers to extract data based on what they can write and published papers. But MBE requires a ultrahigh vacuum, has very slow growth rates, and is difficult to scale up. In the opinion of most people, Shinji included, the method is not suitable for mass production.

That Left MOCVD, which does not need a high vacuum and can be applied to the factory floor. The choice was thus, as they say in Silicon valley, a no-brainer, Shuji selected MOCVD without hesitation, But he had little idea of how MOCVD was done.
By a stroke of good fortune, it just so happened that one of Japan. Leading Experts on the technique was an old acquaintance of his from Tokushima University. Though Shiro Sakai had been two years Sakai’s senior, they had worked together in the same laboratory, and Shuji knew him well.. In the interviewing years, Sakai, now a professor at Tokushima, had become well known for his expertise n MOCVD, Now he was on sabbatical at the University of Florida. During the Summer holiday of 1987, he returned to Japan. Nakamura went to see Sakai to ask hi advice on how to learn MOCVD.

When Sakai returned to Japan for a week at the end of 1987. Nakamura invited hi to Visit Nichia. There, the professor explained to Ogawa the significance of MOCVD as a Crucial tool for the production of state-of-the-Arts LEDs. At this meeting, blue LEDS were not mentioned, Sakai recommended that Nichia should send Nakamura for a year to the engineering school at the University of Florida, where he was currently on sabbatical. A deal was arranged: Nakamura would learn MOCVD under Sakai’s tutelage. In return, Nichia Would donate around $100,000 to fund Sakai’s research.

To make a chip the size of a grain of sand takes a mighty big box. A typical MOCVD system is almost as big as a shipping container and costs well over a million dollars. Seen from outside, MOCVD equipment looks rather dull, like a row of office cabinets. Peek behind the bland-looking doors, however, and you will discover a bewildering assemblage f tanks, pumps and valves connected by what appears t be several miles of thin, stainless steel pipe. At the end of cabinets is a rack containing a computer that runs the recipes for growing LEDs. These are programs that, with exquisite precision, control the pressure and flow of gases, while monitoring the temperature and the rate at which the thin films of crystal grow.

The heart of MOCVD system is through a little window in one of the cabinet doors, it its reactor chamber. This is a cylinder about the size of a cookie jar, made of quartz in some systems, of metal in others. It may, be positioned either horizontally or perpendicularly. The chamber is remarkably small in comparison to the whole. It occupies perhaps 3 or 4 percents of the total space. Inside the jar there is a graphite chuck, mounted on a little pedestal, here sits the wafer on which the thin films are growth. The Chuck is connected via a thermocouple that monitors the growth temperature, to a heater. T grow Gallium Nitride, the wafer is heated to between 1,000 and 1,200 degrees Celsius. At which point it grows bright golden-orange, In case of quartz chambers, the heat comes form copper coils would round the jar. An exhaust system, typically a vacuum pump, completes the process, It sucks the unused gases out of the reactor chamber, flushing them away to a scrubber for disposal.

For more than twenty years LED were grown by one of the two methods, liquid phase epitaxy (LPE) or vapour phase epitaxy (VPE). Epitaxy simply means stacking crystal layer upon crustal exactly the same orientation, like piles of eggs trays, But when it came to growing hg-quality thin films and quantum wells, which require abrupt atomic level transitions from one layer to the next, both processes were too crude. For example, an LPE system consists of a quartz tube in which are .lined up with little graphite dishes called, because of their cigar like shape, “boats, ” Each boat contains a different semiconductor material that is heated until it melts. You slide your wafer along the tube, leaving it to sit a while on top of each boat. Cooling causes some of the materials go precipitate onto the surface of the wafer. LPE produces relatively thick layers, and the boundaries between them are gradually rather than sharply defined. Precise control move thickness almost impossible to achieve.

MOCVD (sometimes, confusingly, also known as MOVPD) system because the method of choice for growing high-brightness devices, original red LEDs, in the mid-1980’s MOCVD accomplished the abrupt transition between layers by allowing the crystal grower to run two mixes of gases through the system simultaneously. While using mix A to grow a film in the reactor, you have all the gases for mix B flowing directly to exhaust, Then, at just the right moment, you switch mix A to the moments. All you hear is sound of the compressed air-driven pneumatic valves. They open and close in quick succession- phsst, phsst, phsst, phsst-et voila! You have grown a quantum well.

So much for vapor deposition, Now we come to metal organic chemicals, why it is necessary to sue such fancy-sounding stuff instead of ordinary metal? The answer is that, in their vapor ;phase neither aluminum, gallium, nor Indium- the three most common metals use in growing bright blue (and Red and green) LEDs- can muster sufficient vapor to be picked up the carried there, in organic form. To pump up the vapour pressure, organize chemical such a Methyl groups are attached to the metals Gallium becomes trimethyl gallium; the positive-types dopant magnesium becomes bis(Cyclopentadienyl) magnesium, mercifully abbreviated as CP2MG. The carrier gas in hydrogen. It is kept Flowing through the system at a rate of many litres per minute. During the travels, the hydrogen bubbles through the temperature of the compounds. Which it transports to the reactor. When the com[pound gases get to the hot zone. They lose their methyl groups. The nitrogen or Gallium nitrides arrives at the jar in the form ammonia.

The heat decomposes the gases. Leaving nitrogen atoms hot to trot their gallium Partners.
The process of growing a gallium nitride LED begins by heating the sapphire wafer to a very high temperature. Once hot, you clean the surface by flowing nitrogen over it. Then you drop the temperature way down to maybe 500 degrees Celsius to grow the first layer, the so called nucleation, or buffer, layer. This is a thin film, typically of gallium or aluminum nitride and juts 50 to 100 atoms thick, that is grown directly on the wafer. The buffer layer is amorphous, that is lacking a crystalline structure. When you heat it up, the surface of this amorphous layer becomes very lumpy as nucleation islands oriented to the surface of the sapphire start to form, As you reach higher temperatures, however, these islands grow together laterally, to form a smooth , mirror-like layer of gallium or aluminum nitride., One of the secrets of growing high-quality GaN is being abe to control exactly how this nucleation layer is deposited, how is crystallizes, and how it grows together during the heat-up step.

On top of the nucleation layer, you deposit plain vanilla (i.e., undoped) gallium nitride.
Next comes a layer of negative-types gallium nitride, wit silane as the electron-donaing dopant. This is followed by a layer of negatively doped aluminum gallium nitride, a compound with a wider bandgap than GaN. This layer plus another . positively doped layer of AlGaN o the other side serve to confine the charge carriers within the active _i.e. light emitting) layer of the device, Then you drop the temperature down from 1,000-1,200 degrees Celsius to 750-850 degrees Celsius s that you can grow an indium gallium nitride quantum well. You grow, say ., 20 angstroms of InGaN, then maybe 100 angstronms of GaN, then repeat the process for as many quantum wells as your recipe calls for, adjusting the amount of indium to produce the desired wavelength of light. The more indium you include, the greener the output will be. After growing the last combo of InGaN+GaN, you crank the temperature back up and deposit your other confining layer of positively doped aluminum gallium nitride. Then you cap the whole thing off with a layer of positive-type gallium nitride using magnesium as the hole-donating dopant, That completed the device.

In a typical growth run, the whole process takes anywhere between two and a half hours and hour hours. If you load your wafer first things in the morning just as the coffee is brewing. You will gte the growth sun out around lunchtime. You should schedule another run around two o’clock and have it out before dinner. Between runs, you have to clean the reactor b baking it out at high temperature. In the R&D lab, two runs is not a bad day. On the production line, four growth runs in a twenty-four-hour period is consider pretty good going. A large production –line reactor may contain a platter with a many as one hundred wafer on board.

The growth process itself is not in the least dramatic. You can hear faint hums and hisses from the pumps and the valves, but that’s about it. The only smell MOCVD machine gives off is a subtle whiff of burnt reactants that emanates from inside the jar, if you smell anything else—ammonia, for example- that means there is a leak, This is a good time to leave the lab. Quickly.
"

Sunday, September 6, 2009

One Stop Solution for LED Manufacturing



Only one company in the World can provide us one stop solution for LED manufacturing equipment.

As they supply bare die sorting machine, Die bonder of various process types such as Epoxy, Direct Eutectic, Flip Chip TS process for various LED chip attach,
Gold ball wire bonder for horizontal and vertical LED devices.

The latest iHawkxtreme is of the fastest wire bonder for LED. It was well recognized as the standard wire bonder for high throughput LED manufacturing environment.

Down the process they have solution on phosphor jetting, Testing and sorting solution for LED of different package TopLED, SideView, Ceramic base HBLED, with various process requirement of say Bowl feeder input, LED on wafer form, output with Tape and Reel or to be sorted on Mylar on film frame for sake of traceability required by Automobile and General illumination industry.

There is certain advance if we use one stop solution. There is minimum tools investment as all equipment can utilize the same tooling such as magazines and carrier. Minimum, investment for spare part as all machines are using the similar modules of control and Motion drivers!

An unique operational pattern as the machine are using same human interface for operation.

Simplify is the key for a streamed line process of Today Hi volume LED manufacturing by going through one supplier, consideration on administration, Single supplier training programme, spare part management, process uniqueness, On line Production System management.

This Company was found in 1975. It is ASM!

Saturday, September 5, 2009

Map Sorting of Package LEDs onto frames






ASM MS899DLA is a high speed map sorter machine especially designed for handling ceramic based LED with dome lens. Input is a cassette of film frame carrying the package LED on the film frame.
The reason is that the LED has to have tracebility up to die level, if that is not placed on mylar in a mapped format, there is no way to trace the LED to the die batch form the Wafer.

The up stream process is either a Panel tester using Integration sphere or a Package LED tester AS899 (ASM’s).

MS899DLA is a fully automatic map sorter machine with Auto cassette handler and max.
120 Bin grade of film frame each represent one specified Bin grade of binned LEDs.

There is a wafer bar code reader to read the lot bar codes or using 2D matrix code camera to read, identify and pull pout the right wafer map from the network for the film frame in process.
The UPH is typically 4,200 for 3mm x3 mm package LED with dome lens.

The Collet is designed not to have any contact on the surface of the dome to minimize scratches.
Typical Cycle time is 430ms for 3 mm x 3mm x 1.6 mm LEDs.

This machine is commonly used for many LED Big players for sorting out their package LED onto 100 bin grades.

Downwards process is to pass the binned wafer on Taping machine LPT08 for putting the package LED onto tape and reel.

Sunday, August 23, 2009

Challenge on LED Die Bonder Equipment


The trend for 1W LED is going to chip scale packaging, and like those major available production in the market, the size of the LED Package is in the range of 3 to 4mm. The material is ceramic substrates, and most of them ate epoxy or Flux Eutectic, process.


There are a lot of challenge and see who can manage this entire factor for a successful launch of such a product in the competitive market. There is no perfect process, however to be a pedigree of LED in the market, firstly we should have a stable supply of LED with high efficacy; as if you are a chip design would be a pre-requisite.


Cost and performance are neighborhood but there is always dilemma when cost is a prioritized factor, as we know the ceramic substrate is quite an expensive item for 4” panel is over few tenth of dollars, all depends on how may LED you can put onto this panel, the larger the panel may be having bigger advantage. The cost as a 6” Panel may be additional 15% more expansive than a 4” panel. So if one can manage to use larger panel would be able to drive down the BOM cost lower by a significant amount.

Easy to talk but hard to achieve, a bigger panel will inevitable bring in certain problem such as die bonder constrain as most of the Die bonder is not able to handle 4” wide panel easily.

Warppage of panel is 3X more with 2X larger in size, the average best panel we can get in the market will be having 0.3%-0.5% the width of warppage with size over 4”.
There is a challenge to take care f the warppage.

The package is gong to be thinner and thinner, the thickness of ceramic panel varies from 0.1mm to 1mm. for LED substrates, and the thickness is running between 0.2mm-0.4mm. The thinner the substrates will have higher challenge on the bonding equipment, as the bonding machine should not create any damages or scratches on the thin panel.


And the machine should be able to have up down anvil block or other method to handle the whole panel without damaging it. As we know that the panel is not flat, naturally the die bonding process and glue dispensing process should have an auto height searching function. The force control of the bond head has to be consistent and not to over drive the dies and in certain cases we have to have certain Bond line thickness >5 microns for epoxy process.

High Silver Epoxy is usually have more than 70% of the silver flakes and the carriers will be less in volumes, the epoxy will be viscous, typical visocity will be in the range of 22,000-40,000 CPS. Such kind of thick epoxy will significantly lower down the UPH , this bottle neck for UPH will have to be solved either by increasing the speed of the dispensing process or double the number of epoxy stage. The Later is seems easier as increasing the speed of Dispensing will have adverse effect on the glue size and volume.

For the latest design approach for manufacturing consideration, Silicone liquid molding process is used, in order to have an aligned fudicial mark align as the molding machine alignment method, the Die bonder should have a similar way for Vision inspection method as the moulding machine, That will require a Global alignment of the whole panel, so there will be requiring the die bonder o have a vision system that cab snap images on the fudicial mark at the four edges of the panel.

In order to maximize the number of LED on the panel, the epoxy has to be dispensing exactly the right amount for the dies, too much of the epoxy will bridge the adjacent circuitry and or creating EOD. That is an important process as it is required to be fast, accuracy, and evenly dispensing on the whole panel with high consistency.

Another challenge is bonding accuracy, when more number so dies is place don the panel, the placement accuracy will be shrinked to a narrow range of +/-20 microns or even smaller and die rotation to a range of +/-1 deg.

As overall summary, the die bonding process requires certain equipment which is
-Placement accuracy +/-20 microns
-Die rotation angle +/-1 deg
-Bonding area is 4” wide or more
-Introduce no scratches or damages on the thin crackers
-Able to detect the bonding level at epoxy and bonding stage
-Able to perform global alignment other than the multi-point vision alignment
-UPH 8,000 or more

Such a sophisticated machine is inevitably expensive, glad to know that ASM AD838 series has a cost effective solution on this!


feverip