ASM MS899DL Map sorting LED machine

The LED wafer has to be tested by wafer prober machine at wafer level, that was tested by probing onto the LED e-poles and the light intensity and lambda are measured. This measured data together with the known X-Y coordinator was record sequentially into a map file. This wafer will be sawn either by Blade sawing machine or laser cut and then break by rolling with special non-electrostatic roller.

Then the LEDs will be passed onto a Map sorter machine to perform the map sorting
There is roughly 30K LED chip of 7milx7mil on a 4” sawn and wafer.

ASM Map sorter MS899DL had been the earliest developed machine platform with enormous experience and process know how on handling the alignment of the chip on the Wafer.

As we can see that if there is a die being sorted wrongly, the rest of the dies will not be correctly been binned. That is a huge losson the LED and that could write off a few thousand dollars.
MS899DL is the latest 3rd generation platform with high speed sorting time of 220 ms for 9mil x9 mil LED Chip.

There is a total 100 bin grades on film frame stored up in form of cassettes. All the operation will be done automatically. An option of AOI (Automatic Optical Inspection) system on the wafer inspection to screen out all those bad cut dies, contaminated or chipped die which was not found at the original panel form.
A auto bar code scanner to read the bar code for auto retrieve of the maps from intranet is the standard operation.

There are certain similar map sorting machines in the market but due to lacking or process experience and support from a mature core technology of vision, motion and linear motion control Technology. There is no way to be qualified by larger LED supplier in the world due to weak software integrity, higher down time and not able to meet a good placement accuracy of +/-1.25 mil at CpK 1.33.

Supported by a team of professional service and process engineering team, ASM can be your only choice for your next buy of Map sorter.

For More Information, you may visit ASM official website :
http://www.asmpacific.com/asmpt/index.htm

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A full Line For Manufacturing HB LED

With 37 years experience in LED bonding solution provider to the LED manufacturers.

ASM is the ONLY company that can provide all solution in every process of LED Manufacturing at Low TCO (Total Cost of Ownership).

This is the list of equipment that ASM can provide.

• Die Sorting machine


• Map Sorting machine


• Die bonder (Directic Eutectic process, Flip Chip process TC or TS, Solder process, Epoxy process or Flux reflow process) for Top LED, side view, Reel to Reel, PCB base or Ceramic Panel of 4 " wide. Accuracy from +/-1 mil CpK 1.67 to at 8,000 UPH.


• Snap Curing oven standalone or to be connected as in line with the Die bonder and Wire bonder


• Gold ball Bonder "iHawkxtreme" as the world fastest Wire bonder on LED applications


• Jetting Dispensing solution or Time Pressure Dispensing for Phosphor silicone on the bonded LED unit


• IdealCompress Automatic Silicone Liquid Moulding machine


• Automatic wafer level LED Silicone liquid moulding machine


• Packaging LED testing, sorting and taping solution including Bowl feeder or Mylar film frame handling with auto loader, turret head for testing and output into Tape and reel solution of on Mylar. with integration Sphere or photo dedector, Vision Inspection on the cosmetic defect, capability to have full 2D matrix code traceability.


• Package LED mapping sorter into 120 bin grades


• Taping Machine with Picking up Package LED from mylar or feeding from bowl feeder into Tape and Reel.

For more technical Information, pls visit ASM official Web site : http://www.asmpacific.com/asmpt/index.htm

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ASM DS520 Jetting machine

ASM has been developing a new jetting machine for the LED yellow phosphor dispensing.

The technology achieved was a result of tremendous effort in the material studies and selection of various jetting methodology.

The jetting performance varies on the silicone material characteristics. A typical Vertical Lamp application is to achieve an UPH of 50K, with jetting weight of 1.6 Grams of silicone material at variance of approx. 10% in weight.

There is certain LED players request to have some data on CIE figure on the jetting machine. However, we should be aware that the following factors would affect the CIE figure after the jetting.

1. The Die tilting

2. The wire bonding loop height variation

3. The variation of the Z height of the LED Cup (variance from 10 microns to 40 microns!)

4. The Silisone material itself

5. The jetting pump repeataibility

6. Temperature

7. Machine parameter and Set-up

They have been working along with more applications and beleive soon the DS520 will be the one of the solutions for the LED phosphor for us. Besdies, the tool is good for epxoy jetting, and underfilling for Flip Chips applications.

For more technical Information, please visit ASM Official Web site :
http://www.asmpacific.com/asmpt/index.htm


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LED Testing, Sorting and Taping Solution

For LED Package testing, Sorting and Taping solution suppliers are classified into a three major players; the Swiss, Japanese, Malaysian and Taiwanese with the first two being the higher end and last two the lower.

And in the recent three years there has been developed a lot new packages which are becoming smaller than 1mm. The testing and sorting machine has been becoming very competitive in price/performance. There are more and more players who has gained a lot of technical knowhow on the design and application of a rotory turret for these pick and place, Test and sort from Bowl feeder input to Bulk bin output as a standard machine design.

ASM, used to be a total solution supplier for the IC, Discrete and CIS (Camera Module Image Senor) provider has been tranformed the latest motion contro,l vision capability and innovative mechanical design with the pick and place process onto the Package LED solution and they have successfully cracked into the competitive market Taiwan.

Large Revenue was generated from the largest Taiwanese LED manufacturers.

The first generation machine thus by demonstarting their UPH/Cost of investment and High MTBA (Mean Time Between assistance).

Now ASM test Sort and taping machine would likely the faster machine in the Package LED arean.

Moreover, with their team of almost 1,000 R & D engineers in Hong Kong, Singapore and China., they would be likely launched the 2nd genersation of machine for handling the popular small foot print ceramic base LED with Silicone Dome Lens with Mylar frame as input and output in form of Tape and Reel. This is mostly welcome by major LED players as the solution can provide a good LED die Tracecability.

Other tapeing machine soltuion is to have a Non-turret Deisgn taping machine which can be true solution for Package LED with dome lens as Turret introduces a lot of Pick and Place process, thus creates inevitable scratches and damages on the LED Lens.

With the intensive learning from vast customer data base on various LED products, fast turn around time for new design evaluation, there will be a infallible New Testing, Sorting and taping products coming up soon!

For More technical Information, Please visit ASM official Wed site :

http://www.asmpacific.com/asmpt/index.htm

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Tosok Discontinues their Bonder Equipment Business

Tosok had a message distibution to their end customers on 28 September stated that
they will discontinue their semiconductor bonding equipment business on 30 Sep. Tosok quoted that the discontinuity of the semi-conductor business was Because of the industry slow down, machine unit price was decreasing and they do not see the forecast for more order in coming months. They will focus on their main business (Car industry and measuring equipment manufacturing).

All the staff in the semi-conductor business will transfer to other groups. They will lose 1.6B Yen (Around USD16M). They may maintain some service support a period of time!

So there might be having certain support issues for theose who are using Tosko Equipement. A lesson to our LED players is to select a financial sound company with good and strong back bone for Growth is one of the important factors to be identified as your long term business partners.

For more technical Information, please visit ASM Web site :

http://www.asmpacific.com/asmpt/index.htm

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