The Most Powerful Die Bonder for High Power LED Manufacturing

From the Courtesy of ASM Pacifc Technolgy Ltd Web Site.

From Courtesy of VisEra Web Site

As what I had previous mentioned, after almost a year, we can visualize that the HB LED has more or less established an industrial standard for a package size of approximately in the range of 3mmx 3mm to 3.45 mm X 3.45mm with height 2mm to 2.6mm By the major players Cree, Osram, Seoul Semi, Nichia, Edison, VisEra…
These will be one of main stream of the HBLED in the coming 5 years at least as these would have certain advantages such as high volume manufacturability, small foot print, high lumen output, Good thermal performance, SMD compatible, high reliable, reasonable good cost structure.
 The Market Demand

In order to put a high power LED chip onto ceramic substrates, we need to ensure that there is no void under the die attaches media such as High silver content epoxy. The epoxy coverage has to be even, and the process control of the dispensing, stamping method has to ensure that the total void should be less than 10% and single void should not be larger than 5%. Thus to avoid “Hot Spot” of the LED during light up operation.

High Density Manufacturing

If we have formed a standard size of say 3mmx3mm footprint, we have to determine the suitable panel size for the ceramic substrate.. Base on today technology, the panel size has to be large enough as the larger the ceramic panel the lower the cost of it as due to reasons of the tooling availability, the efficiency. Now the optimized size such as panel of size 100mmx100mm. That would be a challenge not to create too much warppage, the best industrial product can achieve warp page less than 0.3% of the width of the panel. That is approximately 12 mil of a 4 inch panel. With a 4 x4 inch panel, typically we can obtain about 1,000 HBLEDs. Some smaller Chip Scale LED can even come up with almost 2,000 LED on one Panel.

Liquid Silicone Molding for the Dome lens

It will be the main stream for LED lens using Silicone molding method for certain advantage of Consistency in lighting after years, Silicone material is stable and will not change colour. The Lighting resistance is low. One mould shot can build all the lens on each of the every LED on the ceramic substrates. There is a way to ensure that the Optical centre is aligned with the LED die centre, where by there is a demand to have the Die bonder to have certain alignment method to be same as the down stream molding process. The Die bonder has to perform Ceramic Panel Global alignment on two edges on for 3 or 4 alignment points before the commence of the die bonding.

Challenge on the Die Bonder Accuracy
There is a need to have diode, TSV, or EDS die to be built onto the tiny space of the 3mm x3 mm ceramic substrate there is tough challenge on he epoxy dispensing. As well the 1mmx 1mm HB LED chip has to be living in the tiny House of the cavity with the Diode. The die placement and die rotation has to be better the+/- 38 microns +/-1 degree, under a process capability CpK>1.67! The basic die bonder should have a capability to achieve a die placement of +/- 15 microns. At three sigma for certain Applications.
 Challenge on the Ceramic Panel Handling

Since the panel is thin as 0.3mm under a perimeter of 100mm x100mm, that is fragile and easy to be damaged if the Die bonder design is not able to provide a Smooth transportation on X and Y and Z axes. Well there are ways to do that, either using old fashioned way of belt transportation to transfer the panel from the input magazine into the dispensing stage and then Bonding stage for bonding before passing thought to the output stage. There is way to apply vacuum or mechanical clamping to hold the thin panel, but that should be having soft touch and jam detection or there will be disasters. Imagine that the whole panel is bonded with 1,000 LEDs and during the transportation at output side, there is a mis-placed magazine that would crack the whole panel! The LEDs, Epoxy, ceramic panel will cost over a few hundred Dollars!
 New Generation Die Bonder for LED

In The Market, there is a new Die bonder, that has all the above challenged being tackled, plus

Patent pending Work Holder that would have a smooth Transportation of the ceramic panel with theoretical 0.1 mm Thickness without any Damages. Carrier Free operation, another twenty features such as Magazine Tilt detection, Magazine Orientation detection, Panel Position Detection, Ceramic height profile detection for Epoxy and bond stage. With Full Post Epoxy and Post bond inspection system. Least but not last Die Placement and Rotation process detection.
With an UPH of more than 8,000 with most the above feature being switched on…

This is ASM AD838L new generation Die Bonder for HB LED application.

Feverip

ASM LED Die Bonder AD830

The AD809 fully automatic die-bonder series was one of ASM's main products in serving the semiconductor manufacturing industry during the 80s. It was the first generation of die-bonder developed by ASM. It made its first appearance in the die-bonder market at the end of 80s for world largest IC subcontractor and gradually gained the market acceptance elsewhere in Japan, Taiwan and Sea East Asia.
With the vision of ASM top management led by ex CEO Patrick Lam who brought ASM into another fast growth era 1990… ASM introduced the world for the high throughput solution for LED market. The AD829 in 1996, followed by AD829A advanced versions in 2000. and AD8930 series in 2002, and AD830 in 2005...
With the advantage of having all kinds of packaging exposure, various sorts of LED products, ASM has equipped with all the features and process know-how onto this Current production of LED Epoxy High speed die bonder AD830, which is dominating the whole LED market.
All the major LED makers are using AD830 as their major runner for their LED product, the advantage if AD830 is fast, reliable, accurate with die placement accuracy of +/-1 mil and +/-3 degree, Cycle time for Small chip like 10mil x 10mil is 180 ms. An equivalent UPH of 18,000. It is equipped with Post bond inspection system that monitors the bonded unit at pre-set placement range…at a selected inspection scheme.
AD830 epoxy die bonder is driven by ASM proprietary technology of Linear motor, an US patent fully decoupled Bond head XY module, an Ultra Light Bond Arm that can run a speed of 10G… Driven by latest Module of Motion Control, Synchronized motion of Bond head and ejector system ensuring least minimum impact on the 3 mil thin chips.
In the LED market, there are a lot of rival or competitors for AD830, but, all the hidden technology of AD830 is not able to be copied in days, ASM is a low profile operating company, but the customer is not astonished by the yield 99.95% and MTBA >1 hour, and low down time of AD830. As only a Low profile branding company could bring the best debut of good quality product like not others.
If you are LED manufactures, only you can use the best equipment for manufacturing the brightest LEDs, contact ASM to book you machine AD830 as soon as you can.
HK Snob