Illumitex LLC (Austin, Texas), started in 2005, the company now has 25 employees, with the toolset required to create and test HB-LED prototypes. Mass production will be done in Asia.
Paul Winberg VP of Engineering said a new startup aimed at the high-brightness light-emitting diode (HB-LED) market, says it has proprietary optics technology that will increase the amount of light emitted from the package.
Co-founder and CTO Dung Duong brought optics engineering ideas to the table, when three co-founders started the company in Winberg's garage. "Our packaging technology is such that we approach it from an optics standpoint, with the use of secondary optics," Winberg said. "By doing that, we can direct the light so it all comes down to the front of the package, which gives customers a much smaller package.
Illumitex buys commercial epitaxial sapphire wafers, and builds the diode much as other HB-LED vendors do. The company's advantage lies in the metal reflective layers incorporated into the flip-chip package, the external quantum efficacy is the more important metric. The highly refractive surfaces in an LED and its package can quickly dissipate the emitted brightness and turn light into heat, reducing the thermal benefits that LEDs offer.
The package measures 1.1 mm on a side, and 1.5 mm high, which Winberg said is "much smaller than anything else out there. That advantage stems from the secondary optics in the package, which get more light out." Flip Chip technology is mainly the process of Lumileds and that has certain good points as Gold to gold has very good heat dissipation highway, but the negative side is the high manufacturing cost as the Flip Chip process is slow typical in term of 1-1.2sec a LED, plus the need to have underfill by jetting machine.
There are only a few companies in the world produce Thermosonic Bonding equipment for LED. Namely, ASM, Panasonic and TDK.
Illumitex’s primary product will start at 100 then 150 Lm/W at 300ma driving current...till 2015, they would produce a LED with 300 Lm/W!
Feverip
Paul Winberg VP of Engineering said a new startup aimed at the high-brightness light-emitting diode (HB-LED) market, says it has proprietary optics technology that will increase the amount of light emitted from the package.
Co-founder and CTO Dung Duong brought optics engineering ideas to the table, when three co-founders started the company in Winberg's garage. "Our packaging technology is such that we approach it from an optics standpoint, with the use of secondary optics," Winberg said. "By doing that, we can direct the light so it all comes down to the front of the package, which gives customers a much smaller package.
Illumitex buys commercial epitaxial sapphire wafers, and builds the diode much as other HB-LED vendors do. The company's advantage lies in the metal reflective layers incorporated into the flip-chip package, the external quantum efficacy is the more important metric. The highly refractive surfaces in an LED and its package can quickly dissipate the emitted brightness and turn light into heat, reducing the thermal benefits that LEDs offer.
The package measures 1.1 mm on a side, and 1.5 mm high, which Winberg said is "much smaller than anything else out there. That advantage stems from the secondary optics in the package, which get more light out." Flip Chip technology is mainly the process of Lumileds and that has certain good points as Gold to gold has very good heat dissipation highway, but the negative side is the high manufacturing cost as the Flip Chip process is slow typical in term of 1-1.2sec a LED, plus the need to have underfill by jetting machine.
There are only a few companies in the world produce Thermosonic Bonding equipment for LED. Namely, ASM, Panasonic and TDK.
Illumitex’s primary product will start at 100 then 150 Lm/W at 300ma driving current...till 2015, they would produce a LED with 300 Lm/W!
Feverip
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